TMC Academic Journal is a double-blind peer-reviewed journal with an ISSN (ISBN: 1793-6020), and is registered with the National Library Board of Singapore.
It is also listed in the database of Ulrichweb.com.
The articles published in June/July 2009 issue can be viewed at http://www.tmc.edu.sg/academiccenter/g-tmcjournal-V4I1.html
The next issue of TMC Academic Journal will be published in December 2009. We invite you to submit your original and unpublished research articles, book reviews and reflections in any fields of business, mass communication, hospitality and tourism, psychology and IT for publication in TMC Academic Journal by the due date. All submissions are subjected to a stringent double-blind peer review process.
Important dates for Volume 4, Issue 2, December 2009:
Open for submission: 01/08/2009
Last day of submission: 15/10/2009
Notification of acceptance/rejectio n: 25/11/2009
Submission of final version: 05/12/2009
Authors of accepted papers will be invited to submit their bio data for inclusion in the journal. Authors are also required to sign the Transfer of Copyright Agreement as stated in TMC Publication Guidelines.
We also invite colleagues who are interested in being a reviewer to join our Review Committee. Your thoroughness, detailed and constructive feedback in the review process will both assist the author(s) in improving their manuscripts and the publication in attaining the highest quality. Your contributions are highly appreciated and they will certainly enrich your academic career.
Kindly send your manuscripts via email as attachment in Microsoft Word to
Please do not hesitate to contact us for further information on paper submission.
We look forward to receiving your manuscripts.
Regards,
Dr. Huong Ha BA ILA Cert MPP PhD
Dean
TMC Business School
Chief Editor
TMC Academic Journal
TMC Educational Group
141 North Bridge Road
Capitol Centre (Opposite City Hall MRT)
Singapore 179 099
DID: 6336 7360
E-mail: huong@tmc.edu. sg
Website: www.tmc.edu.sg
Please quote 10 Academic Resources Daily in your application to this opportunity!
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