The project focuses on research of a new cutting machine for cutting silicium with laser beams. The project is a cooperation between the University of Twente, Philips, TNO, CCM, Sioux, ALSI and VDL. The research of the group is mainly aimed at the possibilities of ultra short laser pulses. The ALISS project will develop the necessary technologies to make internal modification by multiple laser beams an enabling technology for the use of very thin and low–k wafers. As such the project will deliver a breadboard environment that will show that laser dicing is possible and that the technology can be transferred to an industrial production environment.
The required laser and breaking processes will be developed as well as pre-prototypes for the execution of the processes
The ALISS project will show that material modification in semiconductor material can be effectively done with a multi-beam approach. This is essential as this unique feature will have a one on one relation with the productivity of the final system. Current approaches only use single beams and need to process dicing streets several times. The possibility to align dicing streets on the dice in stead of on the global wafer markers will make the ALISS concept robust to cope with the developments in assembly.
For detail information please visit:
http://ut-iso.org/lowongan-s3/121/phd-in-a-project-called-advanced-laser-induced- subsurface-separation-aliss
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