PhD Studentship Under bump metallisation technologies for high sensitivity
spectroscopic X-ray detectors
Wolfson School of Mechanical and Manufacturing Engineering
*Reference: CL260906*
A PhD Research Studentship jointly funded by Innovative electronics Manufacturing Research Centre (IeMRC) and CCLRC - Rutherford Appleton Laboratory (RAL) is available. The successful candidate will be based at the Wolfson School of Mechanical and Manufacturing Engineering of Loughborough University, but will spend significant time to carry out the research work at CCLRC-RAL. Funding is available for 3 years starting on 1 October 2006 or as soon as hereafter, subject to satisfactory progress. For Home/EU students the Research Studentship provides a tax free stipend of ~£15000 p.a. plus payment of the Home/EU tuition fee. For overseas students the additional fee may be covered by the School, subject to his/her excellence of qualification. Candidates are expected to hold a good first degree
(First-class, Upper Second-class or equivalent) in Materials Science, Chemistry, Physics, Engineering or a closely related subject.
The aim of the proposed research is to develop processes of metallisation and interconnections suitable for manufacture and assembly of high sensitivity spectroscopic X-ray detectors. The research will involve combining experimental exploitation of potential processes with characterisation and testing of the obtained metallised or interconnected structures at micro- to nano- scale. Novel processes such as electrochemical and other materials deposition techniques will be particularly explored to achieve the goal.
The objectives of the research are:
1. Establish a high yield bump bond interconnect technology in the UK for 4keV - 20keV spectroscopic X-ray sensors and advertise the capability to the Global Synchrotron Facilities.
2. Identify the physical and chemical structure of under bump metallisation for the silicon detector layer and the readout electronics device, before and after assembly and after accelerated life tests.
3. Establish test procedures for 50um and 100um fine pitch, large area chip-on-chip detectors.
4. Establish the exploitation route for fine pitch indium bump bonding onto the newly developed UBM systems.
5. Investigate through industrial partners and their commercial networks other customers and applications.
For further information about the PhD Research Studentship please contact:
Dr Changqing Liu
Wolfson School of Mechanical and Manufacturing Engineering
Loughborough University
Loughborough, Leicestershire
LE11 3TU, United Kingdom
Tel: +44(0) 1509 227681
e-mail: C.Liu@lboro. ac.uk
For application pack and other admission requirements please contact:
Ms J R Mason
Research Administrator
Wolfson School of Mechanical and Manufacturing Engineering
Loughborough University
Loughborough, Leicestershire
LE11 3TU, United Kingdom
e-mail: J.R.Mason@lboro. ac.uk
*Please Quote Ref: CL260906 on Application Form.*
*Closing date for applications is: 7th November 2006.*
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